TS Thin Substrate Scrubbing Cleaner

• Thin substrate of 50-micron thickness is cleaned without any breakage.
  
  
• Supports cleaning of wafers and rectangular substrates with a long side of 40 to 150 mm.
  
  
• High throughput: 250 to 500 substrates per hour.
  
  
• Both sides of substrate are scrubbed simultaneously while subject to 80 kHz ultrasonic wave.
  
  
• Environmentally clean and safe high throughput air-knife drying is performed.
  
  
• Automated loader and unloader from substrate cassette is provided.(PAT.PEND)